This provides the benefit of shortening the computational time of DEM simulations, ultimately allowing engineers to evaluate more design configurations in the same amount of time. For filtration, fluidized beds or biomass furnaces type of applications the Source Smoothing technique automatically smooths and coarsens the underlying computational fluid dynamics (CFD) mesh to make it more appropriate for DEM calculations.While the E-Cool innovation is among the leading enhancements offered in STAR-CCM+ v11.06, this version features many more advancements, offering users significant gains in technology, user experience and productivity. “It utilizes an entirely new concept for quickly managing and exploring their entire product design space to match their industrial engineering objectives.” “This new capability allows engineers to focus their time on making the right decisions for improving the thermal efficiency of their electronics systems,” says Siemens PLM Software senior VP of product management Jean-Claude Ercolanelli. Parts such as fans, heatsinks, chips, and boards can be imported from industry-standard IDF files, or created in STAR-CCM+. E-Cool facilitates the creation and manipulation of electronics components for the thermal performance analysis of board and system level electronics devices. STAR-CCM+ v11.06 introduces the Electronics Cooling Toolset (E-Cool). This latest version of the industry-leading engineering software tool allows engineers to discover better designs, faster and aligns with Siemens’ Smart Innovation Portfolio that helps manufacturers optimize their Digital Enterprise and realize innovation. NEW YORK, NY and LONDON, UK, – Siemens PLM Software, a leading global provider of product lifecycle management (PLM) and manufacturing operations management (MOM) software, announced the latest release of STAR-CCM+ software, version 11.06.

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